The Reliance ATR family of robots provide the proven performance, reliability, and ultra-cleanliness required for today’s advanced semiconductor manufacturing operations. The Reliance ATR robot utilizes direct drive technology and DSP-based control electronics.

Brooks atmospheric robots and modules are an integral part of high-performance atmospheric wafer handling solutions in Process Equipment and Cluster Tool Front Ends for semiconductor material handling applications. A technology and performance leader, Brooks offers cutting-edge robotics solutions that enable new levels of tool precision while accelerating installation and set-up for each tool shipment. Leveraging multiple generations of industry-leading automation standards, Brooks atmospheric robots and modules provide the optimized mix of throughput, repeatability, and cleanliness required for today’s advanced manufacturing processes.

Razor robots provide the superior performance, reliability, and ultra-cleanliness required for today’s advanced semiconductor manufacturing operations. The Brooks kinematic mounting system, patented motion control technology, and reliable direct drive robotics enable fast set-up, high repeatability, and maximum uptime. In addition, Razor robots feature simplified, highly efficient arm architecture with two links instead of three for a 3-FOUP trackless robot that delivers reliable performance — even in high-volume, 24×7 production environments.

The high-performance atmospheric Razor Aligner provides ultra-precise wafer positioning of 200mm, 300mm, or 450mm wafers. Designed for optimal manufacturability, the Razor Aligner and other Razor modules provide high quality out of the box and support fast product installation and reduced lead time. Like all Razor products, the Aligner takes advantage of the Fusion™ Controls automation control solution to enable easy configuration for meeting a wide variety of tool application requirements.

The Razor Aligner provides superior throughput, repeatability, and cleanliness.

YEC has a rich history in motion control and robotics and leverages its exclusive Yaskawa Sigma™ series technology in the motors, encoders and motion controls used in all robots. Through decades of robot development and tens of thousands of robots in operation, YEC continues to enhance and improve upon its world-renowned drive technology. This established technology ensures high reliability and significantly reduces the cost of ownership.

YEC has a rich history in motion control and robotics and leverages its exclusive Yaskawa Sigma™ series technology in the motors, encoders and motion controls used in all robots. Through decades of robot development and tens of thousands of robots in operation, YEC continues to enhance and improve upon its world-renowned drive technology. This established technology ensures high reliability and significantly reduces the cost of ownership.

Transfer Robot for High Throughput Applications in Vacuum Cluster Tools

The MagnaTran® 7 BiSymmetrik™ (MAG 7 B) robot incorporates all the technical advantages of the MagnaTran Product Family resulting in a demonstrated mean cycle between failure (MCBF) of > 11 million.

The simple design has a minimum of moving parts. Its direct magnetic drive has no dynamic vacuum seals thus reducing friction, wear, tear, and torque resulting in fewer failures. Less vibration, low particles, and high positional accuracy without edge contact are achieved by the elimination of stepper motors. The integral, field-proven, control electronics not only provides a smaller footprint but also a lower susceptibility to electronic interference resulting in higher reliability.

Wafer Transfer Robot for Vacuum Cluster Tool Applications
The MagnaTran® 7 Frogleg™ (MAG 7 F) robot incorporates all the technical advantages of the MagnaTran Product Family resulting in a demonstrated mean cycle between failures (MCBF) of > 11 million.

The simple design has a minimum of moving parts. Its direct magnetic drive has no dynamic vacuum seals thus reducing friction and wear resulting in fewer failures. Less vibration, low particles, and high positional repeatability without edge contact are achieved by the elimination of stepper motors. The integral field-proven electronics not only provides a smaller footprint but also a lower susceptibility to electronic interference resulting in higher reliability.

Dual Arm, Same Side Wafer Transfer Robot for Highest Throughput Applications in Vacuum Cluster Tools
The MagnaTran® 7 Leapfrog® (MAG 7 X) robot retains all of the features and benefits of the MagnaTran Product Family while having the highest throughput available in demanding cluster tool applications.

Ultra high throughput is achieved by use of Time Optimal Trajectory™ algorithms. Continuous rotation capability precludes the need for moves of more than 180 degrees. Direct drive servo and proprietary DSP controller minimize vibration. The patented Leapfrog® arm enables both wafer exchange and buffering.

Wafer Transfer Robot for Vacuum Applications Requiring a High Reach/Containment Ratio
The MagnaTran® 7 SCARA (MAG 7) robot incorporates all the technical advantages of the MagnaTran Product Family resulting in a demonstrated mean cycle between failures (MCBF) of > 11 million.

The simple design has a minimum of moving parts. Its direct magnetic drive has no dynamic vacuum seals thus reducing friction and wear, resulting in fewer failures. Less vibration, low particles, and high positional repeatability without edge contact are achieved by the elimination of stepper motors. The integral, field proven, control electronics not only provides a smaller overall footprint but also a lower susceptibility to electronic interference resulting in higher reliability.

Enabling Concurrent Exchange of 4 Wafers in Vacuum for High Throughput, Small Containment Applications
The MagnaTran® 8 QuadraFly robot leverages proven SCARA arm technology and reliable direct drive robotics to provide the simultaneous exchange of four wafers in vacuum within a small containment swing diameter. Additionally, the QuadraFly robot extends the benefits of MagnaTran® 8 field proven, direct drive technology to a patented tri-axial drive. Both the tri-axial drive and the QuadraFly Butterfly armset have been designed to accommodate heavier payloads.

The direct magnetic drive technology improves reliability by reducing the number of parts and eliminating the need for a dynamic seal for vacuum isolation. Eliminating the dynamic seal reduces friction, wear, tear and torque resulting in fewer failures. Eliminating stepper motors and/or transmission coupling mechanisms reduces vibration, particles, backlash and increases positional repeatability.

Wafer Fast Swap Vacuum Robot for Heavy Payload & Small Containment Applications

The dual arm MagnaTran® 8 Radius™ robot extends the benefits of MagnaTran field-proven direct drive technology to a tri-axial drive. In addition, the MagnaTran leverages proven SCARA arm technology to provide sub 4 second fast swaps within a small containment diameter. Both the tri-axial drive and the arm have been designed to accommodate heavier payloads.

The direct magnetic drive technology improves reliability by reducing the number of parts and eliminating the need for a dynamic seal for vacuum isolation. Elimination of the dynamic seal reduces friction, wear, tear and torque resulting in fewer failures. Elimination of stepper motors and/or transmission coupling mechanisms reduces vibration, particles, backlash and increases positional repeatability.

The Brooks InLigner coordinates with the MagnaTran robot to provide wafer centering and edge fiducial orientation for 100 to 200 mm SEMI-standard and Jeida-standard wafers with either notch or flat edge fiducials. Special configurations are also available for use with transparent and/or square substrates, including quartz masks up to 6 inches square. To maximize the use of transport chamber facets for process modules, the InLigner mounts between the load lock and the transport chamber and allows access to the wafers in the lock.

The field-proven InLigner delivers high-precision performance and optimal flexibility.

Brooks atmospheric robots and modules are an integral part of high-performance atmospheric wafer handling solutions in Process Equipment and Cluster Tool Front Ends for semiconductor material handling applications. A technology and performance leader, Brooks offers cutting-edge robotics solutions that enable new levels of tool precision while accelerating installation and set-up for each tool shipment. Leveraging multiple generations of industry-leading automation standards, Brooks’ atmospheric robots and modules provide the optimized mix of throughput, repeatability, and cleanliness required for today’s advanced manufacturing processes.

The Brooks innovative Fusion™ Controls platform is the industry’s most flexible and complete automation control solution. Fully customizable and remarkably easy to use, Fusion Controls delivers maximum performance and uptime, while accelerating time to market and tool profitability.